Single-wafer atmospheric pressure CVD device 'A200V'
Compact the device size as much as possible! Achieve stable film formation and low particle count.
The "A200V" is a single-wafer atmospheric pressure CVD system compatible with φ150 and φ200 mm wafers, covering production from small quantities of diverse products to mass production. By adopting a face-down film formation method, it demonstrates excellent film thickness uniformity, particle control, and embedding performance, depositing silicon oxide films based on SiH4. Additionally, the system can also support options for TEOS-O3 and SiH4-O3. 【Features】 ■ Face-down position ■ Compact device design and configuration ■ Balancing maintainability and high productivity ■ Excellent film thickness uniformity and embedding capability ■ Ensures safety by preventing operators from directly contacting the heating area *For more details, please refer to the PDF materials or feel free to contact us.
- Company：天谷製作所
- Price：Other
